Create highly integrated products with a smaller package and increased functionality

Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.

Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.

Amkor Technology defines advanced SiPs as multi-component, multifunction products in an IC package. They require high-precision assembly technologies, which leverage Amkor’s strengths.

  • Size reduction
  • Ultra-thin package
  • Thin substrate with core and coreless using finer line and spacing
  • Conformal and compartmental shielding
  • Low filler size for mold underfill
  • Fine pitch flip chip and copper pillar
  • Double side assembly
  • Test development and production test
  • Turnkey solution

System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. Laminate based SiP technology is in a front-runner solution and most popular SiP solution for cellular, IoT, power, automotive, networking and computing system integrations.

Existing market uses for SiP include:

  • RF and wireless devices
    Power amplifiers, front-end module, antenna switch, GPS/GNSS modules, cellular handset, and cellular infrastructure, Bluetooth® solutions, 5G NR Antenna-in-Package (AiP)
  • IoT for Wearable and Machine to Machine (M2M)
    Connectivity, MEMS, microcontroller, memory, antenna, PMIC, and other mix-mode devices
  • Automotive applications
    Infotainment and sensory modules

  • Power Modules
    DC/DC converter, LDO, PMIC, battery management and others
  • Logic, analog and mixed-mode technology
    Tablets, PCs, display and audio
  • Computing and networking
    5G networking and modems, data center, storage and SSD
  • Extension of the technology platform to a wider field of application areas is ongoing

AiP/AoP (5G NR) SiP Solutions

Millimeter-wave (mmWave) radio design with beamforming and array antenna will be used in varieties of Advanced SiP products for 5G cellular system. Millimeter electromagnetic wave design is imposing a new challenge for the system designers, components and SiP packaging engineers.

Key Amkor Packaging Technologies for AiP/AoP

  • Greater than 26 GHz achieved
  • Compartmental shielding using laser trench and paste filling technology
  • Partial (selective) conformal shielding
  • Partial molding
  • Body size: up to 23.0 mm x 6.0 mm
  • Substrate layer counts: up to 14 layers
  • Low loss and low dielectric substrate


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