Mobile solutions for 5G and wireless connectivity
Today’s fully-integrated RFFE modules combine power amplifiers (PA), low-noise amplifiers (LNA), switches, transceivers, filters and discrete antenna, in a single package. The integration is accomplished using System in Package (SiP) technologies, including double-sided assembly, advanced wafer-level redistribution layers (RDL), passive component integration and sophisticated RF shielding techniques to provide the most advanced 5G package solutions.
Antenna in Package (AiP) and Antenna on Package (AoP) is a technology where the antenna is no longer a separate component within the wireless device but is integrated into the device package. AiP/AoP simplifies challenges associated with mmWave applications and expedites system design. Today’s AiP/AoP technologies can be implemented through standard or custom SiP modules.
Increase the level of integration for RF front-end modules
To continue to improve the integration and robustness of RFFE solutions, Amkor has developed a Double Sided Molded BGA (DSMBGA) package which allows molded assembly of components on both sides of the substrate. Expanding on years of experience in delivering world-class advanced SiP technology, Amkor was the first OSAT to offer DSMBGA and continues to pave the way for further breakthroughs.
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