This year’s ECTC 2021 has been moved to a virtual platform and will be available online from June 1 – July 4, 2021.
Amkor is a proud Platinum sponsor of this event and will be presenting the following:
“S-Connect Technology: Multi-chip, Fan-Out Interposer for Next-Generation, Heterogeneous Integration”
JiHun Yi, GamHan Yong, MinSu Jeong, JongHyun Jeon, DongHoon Han, WonChul Do, Mike Kelly, Dave Hiner, and JinYoung Khim
“Chip-Last HDFO (High-Density Fan-Out) Interposer PoP”
JaeYoon Kim, KyeRyung Kim, EunYoung Lee, SeHwan Hong, JiHyun Kim, JiYeon Ryu, JiHun Lee, David Hiner, WonChul Do, JinYoung Khim
“Metal Thermal Interface Material for the Next-Generation FCBGA”
YunAh Kim, HyunHye Jung, JoHyun Bae, DongSu Ryu, DongJoo Park, JinYoung Khim
ECTC is the premier international event that brings together the best in packaging, components, and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.