活动

IMAPS Symposium 2024

Amkor Technology 诚邀您参加 2024 年 10 月 1 日至 3 日在马萨诸塞州波士顿的 Encore Boston Harbor Hotel 举办的 IMAPS Symposium。

This year’s program features 5 technical tracks, plus Interactive Poster Session. The technical program will span three days of sessions with an emphasis on Design, Modeling, and Manufacturing.

Amkor will present the following:

• fcCSP 高级总监 Brendan Wells 将发表题为“Selecting Between Strip-Based and Singulated Laminates for Chiplet Packaging Assembly”的演讲
• 机械仿真高级经理 Elizabeth Fortin 将发表题为“Study of The Effect of Gravity Weight on Strip Warpage”的演讲
• 工程总监 Nathan Whitchurch 将发表题为“Trace Fusing Current Simulation in Redistribution Layer of Wafer Level Packages”的演讲
• Chiplets/FCBGA 高级总监 Hoon Jung 将发表题为“Substrate Warpage Study for Chiplets Packaging”的演讲