IMAPS Symposium 2024

Amkor Technology invites you to join us at the IMAPS Symposium on October 1-3, 2024 at Encore Boston Harbor Hotel in Boston, Massachusetts.

This year’s program features 5 technical tracks, plus Interactive Poster Session. The technical program will span three days of sessions with an emphasis on Design, Modeling, and Manufacturing.

Amkor will present the following:

  • Brendan Wells, Sr. Director of fcCSP will present “Selecting Between Strip-Based and Singulated Laminates for Chiplet Packaging Assembly
  • Elizabeth Fortin, Sr. Manager of Mechanical Simulation will present “Study of The Effect of Gravity Weight on Strip Warpage
  • Nathan Whitchurch, Director of Engineering will present “Trace Fusing Current Simulation in Redistribution Layer of Wafer Level Packages
  • Hoon Jung, Sr. Director of Chiplets/FCBGA will present “Substrate Warpage Study for Chiplets Packaging
When: October 1, 2024 - October 3, 2024 Where: Encore Boston Harbor Hotel Location: Boston, Massachusetts

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