Amkor Technology invites you to join us at this year’s Semi-Therm Forum being held on March 19-23, 2018 at the Doubletree Hotel in San Jose, CA USA. SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.
Amkor will be presenting the following:
- “Multi Die Packaging Integration and Thermal Super-Position”
Mike Kelly1, Phillip Fosnot1, Jonathan Wei2, Max Min3 and Jesse Galloway1
1 Amkor Technology, 2 eSilicon, 3 Samsung
- “Developing A Steady-State Theta jc Testing Standard For Electronic Packages”
Jesse Galloway1 and Eduardo de los Heros2
1 Amkor Technology, 2 Qualcomm Technology Inc.
- “Package Thermal Challenges Due to Changing Mobile System Form Factors”
Cameron Nelson, Amkor Technology