Samsung SAFE Forum 2019
Amkor Technology is pleased to be part of the Samsung Advanced Foundry Ecosystem (SAFE) Forum being held at the Samsung @First campus in San Jose, California on October 17.
Mike Kelly, VP, Adv Package & Technology Integration at Amkor Technology, will be presenting “2.5D TSV: A Path to Heterogeneous Integration”
Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.
When: October 17, 2019
Where: San Jose, California
Location: Samsung @First Campus
More Upcoming Events
Packaging Chips with CHIPS: West Coast Summit
IEMT 2024
