Samsung SAFE Forum 2019

Amkor Technology is pleased to be part of the Samsung Advanced Foundry Ecosystem (SAFE) Forum being held at the Samsung @First campus in San Jose, California on October 17.

Mike Kelly, VP, Adv Package & Technology Integration at Amkor Technology, will be presenting “2.5D TSV: A Path to Heterogeneous Integration

Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: October 17, 2019 地点:加利福尼亚州圣何塞 Location: Samsung @First Campus


第 26 届 Lithography Workshop

ASTC 2019