Samsung SAFE Forum 2019

Amkor Technology is pleased to be part of the Samsung Advanced Foundry Ecosystem (SAFE) Forum being held at the Samsung @First campus in San Jose, California on October 17.

Mike Kelly, VP, Adv Package & Technology Integration at Amkor Technology, will be presenting “2.5D TSV: A Path to Heterogeneous Integration

Amkor 将和在场的封装专家一道进行演示,回答问题并讨论您的 IC 封装需求。

When: October 17, 2019 地点:加利福尼亚州圣何塞 Location: Samsung @First Campus

更多未来大事件

第 22 届 Electronics Packaging Technology Conference

CSIA – ICCAD 2020

Technology Unites Global Summit