삼성 SAFE 포럼 2019

Amkor Technology is pleased to be part of the Samsung Advanced Foundry Ecosystem (SAFE) Forum being held at the Samsung @First campus in San Jose, California on October 17.

Mike Kelly, VP, Adv Package & Technology Integration at Amkor Technology, will be presenting “2.5D TSV: A Path to Heterogeneous Integration

Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: October 17, 2019 장소: 캘리포니아주 산호세 Location: Samsung @First Campus

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