Amkor Technology, Inc. is the proud sponsor and participant in the panel “The Future Advanced Packaging Ecosystem: Who Will Be in the Driver’s Seat?” on Tuesday, October 6 from 3:00 pm-4:30 pm EST at IMAPS 2020.
As the industry moves to the next silicon nodes, new advanced semiconductor packaging developments are enabling the economic gains that were previously achieved with monolithic silicon scaling. The co-design of IC and package becomes increasingly important. The foundry plays an increasingly important role. The development of a healthy eco-system is critical to providing solutions to meet our industry needs. This panel will discuss the eco-system, challenges the industry faces, and the roles for the players.
Chair and Moderator:
- E. Jan Vardaman, TechSearch International
- Mike Kelly, Amkor
- Khai Nguyen, NVIDIA
- Craig Orr, Samsung Electronics
- Koushik Banerjee, Intel Corporation
- Dan Berger, GLOBALFOUNDRIES
- Eelco Bergman, ASE
- M. Ashkan Seyedi, Hewlett Packard Enterprise