活动

IMAPS Symposium 2024

Amkor Technology invites you to join us at the IMAPS Symposium on October 1-3, 2024 at Encore Boston Harbor Hotel in Boston, Massachusetts. Amkor will be exhibiting at Booth #425 with our packaging experts to answer questions and discuss your IC design, packaging, and test needs.

This year’s program features 5 technical tracks, plus Interactive Poster Session. The technical program will span three days of sessions with an emphasis on Design, Modeling, and Manufacturing.

Amkor will be participating as follows:

• fcCSP 高级总监 Brendan Wells 将发表题为“Selecting Between Strip-Based and Singulated Laminates for Chiplet Packaging Assembly”的演讲
• Nathan Whitchurch, Director of Engineering will present “Study of The Effect of Gravity Weight on Strip Warpage“
• 工程总监 Nathan Whitchurch 将发表题为“Trace Fusing Current Simulation in Redistribution Layer of Wafer Level Packages”的演讲
• Chiplets/FCBGA 高级总监 Hoon Jung 将发表题为“Substrate Warpage Study for Chiplets Packaging”的演讲
• Mike Kelly, VP, Chiplets/FCBGA will join the panel session “RDL Packaging for High Performance Applications“