System in Package solutions for mobile applications
Amkor’s System in Package (SiP) is popular with the industry’s demand for higher levels of integration and lower cost. Our SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. We have a proven track record as the industry leader in SiP design, assembly and test. These products are built in our state-of-the-art factory in Korea.
Packages for small form factor
SiP
System in Package
DSMBGA
Double Sided Mold Package
AiP/AoP
Antenna in/on Package
Applications
RF
Wearables
Automotive Compute
Mobile solutions for 5G and wireless connectivity.
- RFFE modules, AiP/AoP
- Integration, shielding
- Test, turnkey service
- Supply chain management
- Best-in-class manufacturing
Quick to market using “off the shelf” components and industry-leading design rules.
- Watch, earbuds, fitness, medical
- Package miniaturization
- Performance, high integration
- Test, turnkey service
High-performance solutions in a small footprint.
- Infotainment, ECU, connectivity
- IATF16949 certified
- Test, turnkey service
- Supply chain management
Questions?
Contact an Amkor expert by clicking the request info button below.