Wafer Level Packaging으로 모든 packaging 체계를 구현합니다.

Amkor offers a broad array of Wafer Level Packaging (WLP) capabilities and processes for packaging schemes from fan-out to chip scale to 3D to System-in-Package (SiP). Our advanced manufacturing operations in Korea, China, Taiwan, and Portugal are adjacent to major foundries, enabling the integration of factory logistics and reducing time-to-market.

The WLP family is applicable for a wide range of semiconductor device types while leveraging the smallest form factor and high performance from high-end RF WLAN combo chips, to FPGAs, power management, Flash/EEPROM, integrated passive networks and standard analog.

WLCSP

고성능, 소형화된 패키지에 더 많은 반도체를 수용할 수 있는 패키지

WLCSP+

제품의 우수한 내구성을 위한 패키지 솔루션

WLFO

3D multi-component package designs를 가능하게 하는 패키지

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