좁은 공간을 요구하는 플라스틱 leadframe 패키지

TSSOPs (Thin-Shrink Small Outline Packages) and MSOPs (Micro Small Outline Packages) are leadframe-based and plastic encapsulated, suited for applications requiring 1 mm or less mounted height. TSSOPs/MSOPs are industry standard and run in very high volume. They provide a value-added, cost-effective solution for a wide range of applications. New developments include larger/higher density leadframe strips and leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.

특징

  • 저비용을 위한 Cu wire bond
  • 표준 JEDEC 패키지 규격
  • 멀티 다이 조립 생산 능력
  • strip 테스트 옵션을 포함한 Turnkey 테스트 서비스
  • ExposedPad 구조 가능

Q & A

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