Lightweight and thin package solution

Amkor’s broad line of Thin Quad Flat Packages (TQFPs) is well suited for customers that require reliable, cost-effective packages that are well established in the semiconductor industry. A wide range of body sizes and lead counts make this a versatile solution for many applications. TQFP packages are particularly valuable for applications requiring broad performance characteristics. Applications include computing, video/audio, gaming, data acquisition, office equipment, automotive, industrial, storage and communications.

TQFP는 DSP, PLD, 마이크로프로세서, PMIC 컨트롤러 및 ASIC를 포함한 대부분의 IC 반도체 기술에 이상적인 패키지입니다. 앰코는 고객맞춤형 leadframe 설계뿐 아니라 open-tooled 방식으로 leadframe의 다양한 die pad 크기를 제공합니다.


  • 5 x 5 mm에서 20 x 20 mm의 패키지 크기
  • 32–176의 lead 개수
  • A broad selection of die pad sizes
  • Copper leadframes
  • 제품 두께 1.0 mm
  • 고객맞춤형 leadframe 설계 가능
  • Low-stress BOM for stress-sensitive products
  • 무연, 유해물질규제 (RoHS) 준수

Q & A

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