Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 7-10.

Amkor will participate in the following:

General Chair – Prasad Dhond, Amkor’s VP, Wirebond BGA Products – Automotive Segment

March 8, 10:30-11:00 AM – FOWLP & FLIP CHIP: PROCESS Session
“Empowering Front-End Cellular Innovations with Advanced SiP Solutions”
Curtis Zwenger, VP, Advanced SiP Product Development

March 8, 11:00-11:30 AM – 2D/3D APPLICATION & DESIGN Session
Heterogeneous IC Packaging, Optimizing Performance and Cost
Mike Kelly, VP, Advanced Package & Technology Integration; Dave Hiner, Sr Director, Package Development; George Scott, Director, Package Development; Doug Scott, Vice President, Wafer Level Packaging; Kevin Engel, CVP, R&D

March 8, 4:30-5:00 PM – 2D/3D TECHNOLOGY Session
Thermal Performance Simulation of Heterogeneous Integration and Coupled Thermal-Mechanical Simulation of Large Body HDFO
Nathan Whitchurch, Sr. Staff Engineer, Engineering, Wei Lin, Sr. Director, Design Optimization, Mike Kelly, VP, Advanced Package & Technology Integration

March 8, 5:00-5:30 PM – TP2: FOWLP & FLIP CHIP: EQUIPMENT/MATERIALS Session
Indium Alloy Thermal Interface Materials for High-Power Lidded FCBGA Products
YoungDo Kweon, Sr. Director; Mike Kelly, VP, Advanced Package & Technology Integration

Amkor is a Gold Sponsor for this event. Amkor will be exhibiting at Booth #38 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: March 7, 2022 - March 10, 2022 Where: Fountain Hills, Arizona Location: WekoPa Resort and Casino

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