Events

IMAPS 2019 – 52nd International Symposium on Microelectronics

General Chair: Curtis Zwenger, VP – Adv Package & Technology Integration at Amkor Technology.

Track Co-Chair of SiP/SiM/CPI (System Solutions): Suresh Jayaraman, Sr Director, Package Development at Amkor Technology.

Amkor is a co-author of a paper being presented by WiSpry:

“Low-Density Fan-Out (LDFO) Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch”
Rameen Hadizadeh¹, Anssi Laitinen¹, Niko Kuusniemi¹, Volker Blaschke¹, David Molinero¹, WiSpry, Inc.
Eoin O’Toole², Márcio Pinheiro², Amkor Technology, Inc.