IMAPS 2019 – 第 52 届国际微电子研讨会
Amkor Technology invites you to join us at IMAPS 2019 on September 30 – October 3, 2019, in Boston, Massachusetts.
Curtis Zwenger, VP – Adv Package & Technology Integration at Amkor will be the General Chair and Suresh Jayaraman – Sr Director, Package Development at Amkor will be the Track Co-Chair of SiP/SiM/CPI (System Solutions).
Wednesday, October 2 at 11:00 AM – 11:25 AM
TRACK 2: Wafer Level/Panel Level (Advanced RDL)
Suresh Jayaraman will be presenting “Advanced Packaging: Taking another look at Heterogeneous Integration”
Amkor is a co-author of a paper being presented by WiSpry:
“Low-Density Fan-Out (LDFO) Heterogeneous Integration of MEMS Tunable Capacitor and RF-SOI Switch”
Rameen Hadizadeh1, Anssi Laitinen1, Niko Kuusniemi1, Volker Blaschke1, David Molinero1, WiSpry, Inc.
Eoin O’Toole2, Márcio Pinheiro2, Amkor Technology, Inc.