IMAPS 2019 – 第 52 届国际微电子研讨会

General Chair: Curtis Zwenger, VP – Adv Package & Technology Integration at Amkor Technology.

Track Co-Chair of SiP/SiM/CPI (System Solutions): Suresh Jayaraman, Sr Director, Package Development at Amkor Technology.

Amkor is a co-author of a paper being presented by WiSpry:

“Low-Density Fan-Out (LDFO) Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch”
Rameen Hadizadeh1, Anssi Laitinen1, Niko Kuusniemi1, Volker Blaschke1, David Molinero1, WiSpry, Inc.
Eoin O’Toole2, Márcio Pinheiro2, Amkor Technology, Inc.

When: September 30, 2019 - October 3, 2019 Where: Boston, Massachusetts Location: Sheraton Boston

更多未来大事件

中国国际半导体高层峰会

SiP Conference China 2019

NEPCON Nagoya 2019