Events

ISMP 2026

Amkor Technology will be attending the 24th International Symposium on Microelectronics Packaging (ISMP), a leading industry event focused on the latest developments in microelectronics packaging technologies, materials, processes, equipment, design, and reliability. ISMP brings together semiconductor and electronics professionals from across the ecosystem to exchange ideas, share insights, and explore emerging trends shaping the future of packaging innovation. The event will take place on November 3–6, 2026, at Paradise Hotel Busan in Busan, Korea.

Amkor team members will be on-site throughout the symposium to connect with customers, partners, and industry peers. The event provides an excellent opportunity to discuss evolving industry needs, strengthen strategic relationships, and engage in conversations around the technologies and innovations driving the next generation of semiconductor packaging.

As a global leader in semiconductor packaging and test services, Amkor is committed to collaborating with customers, partners, and industry peers to strengthen the semiconductor ecosystem, foster innovation, and support the technologies shaping the future while advancing what’s next.