IMAPS 2019 – 제52회 마이크로일렉트로닉스 국제 심포지엄

Amkor Technology invites you to join us at IMAPS 2019 on September 30 – October 3, 2019, in Boston, Massachusetts.

Curtis Zwenger, VP – Adv Package & Technology Integration at Amkor will be the General Chair and Suresh Jayaraman Sr Director, Package Development at Amkor will be the Track Co-Chair of SiP/SiM/CPI (System Solutions).

Wednesday, October 2 at 11:00 AM – 11:25 AM
TRACK 2: Wafer Level/Panel Level (Advanced RDL)
Suresh Jayaraman will be presenting “Advanced Packaging: Taking another look at Heterogeneous Integration

Amkor is a co-author of a paper being presented by WiSpry:

“Low-Density Fan-Out (LDFO) Heterogeneous Integration of MEMS Tunable Capacitor and RF-SOI Switch”
Rameen Hadizadeh1, Anssi Laitinen1, Niko Kuusniemi1, Volker Blaschke1, David Molinero1, WiSpry, Inc.
Eoin O’Toole2, Márcio Pinheiro2, Amkor Technology, Inc.

When: September 30, 2019 - October 3, 2019 장소: 매사추세츠주 보스턴 Location: Sheraton Boston

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