IMAPS 2019 – 제52회 마이크로일렉트로닉스 국제 심포지엄

General Chair: Curtis Zwenger, VP – Adv Package & Technology Integration at Amkor Technology.

Track Co-Chair of SiP/SiM/CPI (System Solutions): Suresh Jayaraman, Sr Director, Package Development at Amkor Technology.

Amkor is a co-author of a paper being presented by WiSpry:

“Low-Density Fan-Out (LDFO) Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch”
Rameen Hadizadeh1, Anssi Laitinen1, Niko Kuusniemi1, Volker Blaschke1, David Molinero1, WiSpry, Inc.
Eoin O’Toole2, Márcio Pinheiro2, Amkor Technology, Inc.

When: September 30, 2019 - October 3, 2019 Where: Boston, Massachusetts Location: Sheraton Boston

Events 더 보기

NEPCON Nagoya 2019

SEMICON Taiwan 2018

European MEMS & Sensors Summit