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IMAPS 2019 – 제52회 마이크로일렉트로닉스 국제 심포지엄

Amkor Technology invites you to join us at IMAPS 2019 on September 30 – October 3, 2019, in Boston, Massachusetts.

Curtis Zwenger, VP – Adv Package & Technology Integration at Amkor will be the General Chair and Suresh Jayaraman – Sr Director, Package Development at Amkor will be the Track Co-Chair of SiP/SiM/CPI (System Solutions).

Wednesday, October 2 at 11:00 AM – 11:25 AM
TRACK 2: Wafer Level/Panel Level (Advanced RDL)
Suresh Jayaraman will be presenting “Advanced Packaging: Taking another look at Heterogeneous Integration”

Amkor is a co-author of a paper being presented by WiSpry:

“Low-Density Fan-Out (LDFO) Heterogeneous Integration of MEMS Tunable Capacitor and RF-SOI Switch”
Rameen Hadizadeh¹, Anssi Laitinen¹, Niko Kuusniemi¹, Volker Blaschke¹, David Molinero¹, WiSpry, Inc.
Eoin O’Toole², Márcio Pinheiro², Amkor Technology, Inc.