Events

ISIG Executive Summit SEA

Amkor Technology will be attending ISIG Executive Summit SEA, a high-level industry event bringing together semiconductor leaders to discuss innovation, manufacturing intelligence and supply-chain resilience across the semiconductor ecosystem. The event will take place October 27-28, 2026, at the Eastern & Oriental Hotel in Penang, Malaysia.

The two-day summit brings together senior executives, technology leaders and strategic partners from across the semiconductor value chain to discuss the opportunities and challenges shaping Southeast Asia’s semiconductor industry. Day 1, the Advanced Packaging Leader Summit, focuses on ecosystem collaboration, advanced packaging, silicon photonics, co-packaged optics and compound semiconductors, while Day 2, the Fab Leader Summit, explores manufacturing intelligence, yield optimization, resilient fab operations and supply-chain strategy.

As a global leader in semiconductor packaging and test services, Amkor is committed to collaborating across the semiconductor value chain to support innovation, strengthen supply-chain resilience and help drive the future of advanced packaging while advancing what’s next.