Events

ECTC 2022

Amkor Technology invites you to join us at ECTC 2022 on May 31-June 3 in San Diego, California at the Sheraton San Diego Hotel and Marina. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

Amkor is presenting the following:

“A Hybrid Panel Level Technology (HPLT) Based on a 650 mm x 650 mm Platform”
Eoin O´Toole, José Luís Silva, Filipe Cardoso, José Silva, Luís Alves, Márcio Souto, Nuno Delduque, Aníbal Coelho, José Miguel Silva, WonChul Do, JinYoung Khim – Amkor Technology Portugal and Amkor Technology Korea

“Thermal Performance of Advanced TIM for High Power FCBGA”
YoungJoon Koh, SangHyuk Kim, EunSook Sohn, JinYoung Khim – Amkor Technology Korea

“Next Gen LAB (Laser-Assisted Bonding) Technology”
SeokHo Na, MinHo Gim, ChoongHoe Kim, DongHyeon Park, DongSu Ryu, DongJoo Park, JinYoung Kim – Amkor Technology Korea

“Optimization of Temporary Carrier Technology for HDFO Packaging”
JinKun Yoo, DooWon Lee, KiYeul Yang, SeokHoon Yoon, Ji Hyun Kim, WonChul Do, JinYoung Khim – Amkor Technology Korea

“3D Embedded Power Package Solution to Integrate Various Power Systems”
ByongJin Kim^1,2, HyeongIl Jeon¹, DaeYoung Park¹, GiJeong Kim¹, Nam-Hee Cho², JinYoung Khim¹

¹ Amkor Technology Korea
²Materials Science and Engineering of Inha University

“S-SWIFT^® with Fine Pitch Embedded Trace RDL”
SangHyun Jin, WonChul Do, JinSuk Jeong, HyunGoo Cha, YunKyung Jeong, JinYoung Khim – Amkor Technology Korea

Amkor will be exhibiting at Booth #403 with our packaging experts on hand to answer questions and discuss your IC packaging needs.