活动

ECTC 2022

Amkor Technology 邀请您与我们一起参加在 5 月 31 日至 6 月 3 日举办的 ECTC 2022，地点为加州圣迭戈市的 Sheraton San Diego Hotel and Marina。ECTC 是在合作环境和技术交流中提供一流封装、元件、微电子系统科学、技术和教育的全球顶尖活动。

Amkor 将发表下列演讲：

“A Hybrid Panel Level Technology (HPLT) Based on a 650 mm x 650 mm Platform”
Eoin O´Toole、José Luís Silva、Filipe Cardoso、José Silva、Luís Alves、Márcio Souto、Nuno Delduque、Aníbal Coelho、José Miguel Silva、WonChul Do、JinYoung Khim – Amkor Technology Portugal 和 Amkor Technology Korea

“Thermal Performance of Advanced TIM for High Power FCBGA”
YoungJoon Koh、SangHyuk Kim、EunSook Sohn、JinYoung Khim – Amkor Technology Korea

“Next Gen LAB (Laser-Assisted Bonding) Technology”
SeokHo Na、MinHo Gim、ChoongHoe Kim、DongHyeon Park、DongSu Ryu、DongJoo Park、JinYoung Kim – Amkor Technology Korea

“Optimization of Temporary Carrier Technology for HDFO Packaging”
JinKun Yoo、DooWon Lee、KiYeul Yang、SeokHoon Yoon、Ji Hyun Kim、WonChul Do、JinYoung Khim – Amkor Technology Korea

“3D Embedded Power Package Solution to Integrate Various Power Systems”
ByongJin Kim^{1, 2}、HyeongIl Jeon¹、DaeYoung Park¹、GiJeong Kim¹、Nam-Hee Cho²、JinYoung Khim¹

¹Amkor Technology Korea
²仁荷大学材料科学与工程学院

“S-SWIFT^® with Fine Pitch Embedded Trace RDL”
SangHyun Jin、WonChul Do、JinSuk Jeong、HyunGoo Cha、YunKyung Jeong、JinYoung Khim – Amkor Technology Korea

Amkor 将在第 403 号展位和在场的封装专家一道进行演示，回答问题并讨论您的 IC 封装需求。