Advanced Packaging Summit (APS 2023)

Amkor Technology invites you to join us at the Advanced Packaging Summit (APS 2023) on September 5, 2023, at the Suwon Convention Center.

SeokHo Na, Senior Director, Expert Process/Material Research at Amkor Korea will be presenting “Laser-Assisted Bond (LAB) Technology Overview” on Tuesday, September 5 from 3:30 PM – 4:00 PM during Session 2: Interconnection Technology for HPC.

When: September 5, 2023 Where: Suwon Convention Center Location: Suwon, South Korea

More Upcoming Events

TSMC Technology Symposium China 2024

APQ “Q OPENDAY”

Goldman Sachs Global Semiconductor Conference 2024