4th Panel Level Consortium Symposium
Amkor Technology invites you to the 4th Panel Level Consortium Symposium being held on September 8, 2022, at the Fraunhofer IZM building in Berlin, Germany.
Eoin O’Toole, Sr. Manager R&D at Amkor Technology Portugal, will be presenting “A Hybrid Panel Platform Based on a 650 mm Panel” from 10:45 AM – 11:15 AM.
Together with 17 partners from the industry, Fraunhofer IZM has successfully finished the second phase of the Panel Level Consortium – PLC2.0. Join us in Berlin to discuss the status, progress and limits of Panel Level Packaging with experts from around the globe. Speakers from industry and science will bring you up to date on what has been achieved within PLC2.0, including:
- Market and application trends
- Latest technology results for PLP
- Material, equipment and process developments for large area and fine line processing
- Cost analysis
The Symposium is preceded by the wrap-up meeting of the PLP Consortium 2.0 on September 7, 2022.