3DFabric™ Alliance Workshop

Join Amkor Technology for the 4th 3DFabric™ Alliance Workshop on April 22 at the TSMC North America office in San Jose, California.

Ruben Fuentes, VP, Design Center at Amkor will present “Package Assembly Design Kits (PADK) – The Foundation for Advanced Wafer-Level Manufacturing & Assembly“.

This workshop will explore how a 3DFabric partnership between Amkor and TSMC will further improve the digital supply chain of advanced wafer-level packages. The concentration will be on how leveraging Amkor’s packaging knowledge and experience, which are embedded into SmartPackageTM PADKs, coupled with the latest EDA software offerings integrated with the 3DFabric technologies, will define a design foundation readiness, and set the course for success.

When: April 22, 2024 Where: TSMC North America office Location: San Jose, California

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