Events

3DFabric™ Alliance Workshop

Join Amkor Technology for the 4^th 3DFabric™ Alliance Workshop on April 22 at the TSMC North America office in San Jose, California.

Ruben Fuentes, VP, Design Center at Amkor will present “Package Assembly Design Kits (PADK) – The Foundation for Advanced Wafer-Level Manufacturing & Assembly“.

This workshop will explore how a 3DFabric partnership between Amkor and TSMC will further improve the digital supply chain of advanced wafer-level packages. The concentration will be on how leveraging Amkor’s packaging knowledge and experience, which are embedded into SmartPackage^TM PADKs, coupled with the latest EDA software offerings integrated with the 3DFabric technologies, will define a design foundation readiness, and set the course for success.