以更小型封装和功能提升打造高集成产品

Semiconductor industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. Amkor’s SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. By assembling, testing and shipping millions of SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test.

Amkor’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, South Korea. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.

System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. Laminate based SiP technology is in a front-runner solution and most popular SiP solution for cellular, IoT, power, automotive, networking and computing system integrations.

采用 SiP 的现有市场包括:

  • RF and wireless devices
    Power amplifiers, front end module, antenna switch, GPS/GNSS modules, cellular handset and cellular infrastructure, Bluetooth® solutions and 5G NR
  • 物联网时代的穿戴式和机器对机器 (M2M)
    Connectivity, MEMS, microcontroller, memory, antenna, PMIC and other mix-mode devices
  • 汽车应用
    资讯娱乐和传感器模块

  • 功率模块
    DC/DC 转换器、LDO、电池管理及其他
  • 逻辑、模拟和混合模式技术
    平板电脑、PC、显示屏和音频
  • 计算和网络
    5G 网络和调制解调器、数据中心、存储和 SSD

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