Amkor Technology invites you to join us at the 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS 2023) on August 6-9, 2023, at the Tempe Mission Palms in Tempe, Arizona.
Vineet Pancholi, Sr Director, Test Technology at Amkor, will be presenting “Production Test of 3DIC Packages, An OSAT Perspective” on Wednesday, August 9, from 8:00 AM – 8:18 AM.
The chipset-based design adds new issues to the testing process. Tests must now cover individual chiplets, the interconnections among them, and the entire package. Depending on the design complexity, testing could significantly increase time-to-market. How can developers keep such effects at a tolerable and affordable level? Is there any design for test (DFT) methods available, when included in the architecture, that will help with test coverage and yet simplify production testing? EDA (Electronic Design Automation) companies and IEEE forums have significantly contributed and continue to contribute towards the large variety of 3DICs under development. Automation must be stressed, and new techniques, such as agent-based monitoring, must be evaluated. Test considerations must play a key role in heterogeneous integration and package development. Only a thorough integration of test with the entire development process will do the job. Due to higher levels of integration at the package, manufacturing test flows must be altered for the most optimal test coverage. System Level Test (SLT) will continue to play a vital role in Manufacturing Test Flows. Content re-distribution in each test step may be necessary.