Amkor Technology invites you to join us at the IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 18-21, 2024. Amkor is a Gold Sponsor for this event. We will be exhibiting at booths 38 and 39 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

Amkor 将参加以下活动:

Mike Kelly, VP, Chiplets/FCBGA Technology Integration will be a panelist on the evening panel “Looking for the Next Killer Application: Will Heterogeneous Integration be the Enabler?” on Tuesday, March 19 from 7:00 – 8:00 PM.

3 月 21 日星期四,上午 10:00-10:30 – THA1:异构 2D 和 3D 集成主题:产品应用
“芯片和异构 IC 封装: 构件与权衡”
Mike Kelly,Chiplet/FCBGA 技术集成副总裁(摘要

3 月 20 日星期三,下午 6:00–8:00 – IMAPS 海报展示会
“用于先进半导体产品的高散热性能热界面材料 (TIM)
YoungDo Kweon,Chiplets/FCBGA 开发高级总监(摘要

“热增强、热扩散 ChipArray® BGA (CABGA) 封装的低成本解决方案
KyungSu Kim,打线 BGA 和 MLF 产品高级总监(摘要

“Pursuing Optimal Cost of Ownership in Leadless Leadframe Packaging
Mike Flatley, Sr. Manager, MLF Products & Brad Moore, Sr. Director, MLF Products (abstract)

“Amkor In-house Test Solutions
Vineet Pancholi, Sr. Director, Test Technology (abstract)

时间:2024 年 3 月 18 日 - 2024 年 3 月 21 日 场地:WekoPa Resort 地点:亚利桑那州喷泉山


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