Amkor Technology invites you to join us at the IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 18-21, 2024. Amkor is a Gold Sponsor for this event. We will be exhibiting at booths 38 and 39 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

Amkor will participate in the following:

Mike Kelly, VP, Chiplets/FCBGA Technology Integration will be a panelist on the evening panel “Looking for the Next Killer Application: Will Heterogeneous Integration be the Enabler?” on Tuesday, March 19 from 7:00 – 8:00 PM.

Thursday, March 21, 10:00-10:30 AM – THA1: Heterogeneous 2D & 3D Integration Track: Product Application
“Chiplets and Heterogeneous IC Packaging: Building Blocks and Tradeoffs”
Mike Kelly, VP, Chiplets/FCBGA Technology Integration (abstract)

Wednesday, March 20, 6:00 – 8:00 PM – IMAPS Poster Session
“High Thermal Performance Thermal Interface Material (TIM) for Advanced Semiconductor Products
YoungDo Kweon, Sr. Director, Chiplets/FCBGA Development (abstract)

“Low-Cost Solution for Thermally Enhanced, Heat-Spreader ChipArray® BGA (CABGA) Packages
KyungSu Kim, Sr. Director, Wirebond BGA & MLF Products (abstract)

“Pursuing Optimal Cost of Ownership in Leadless Leadframe Packaging
Mike Flatley, Sr. Manager, MLF Products & Brad Moore, Sr. Director, MLF Products (abstract)

“Amkor In-house Test Solutions
Vineet Pancholi, Sr. Director, Test Technology (abstract)

When: March 18, 2024 - March 21, 2024 Where: WeKoPa Resort Location: Fountain Hills, Arizona

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