Amkor Technology invites you to join us at the IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 18-21, 2024. Amkor is a Gold Sponsor for this event. We will be exhibiting at booths 38 and 39 with our packaging experts on hand to answer questions and discuss your IC packaging needs.


Mike Kelly, VP, Chiplets/FCBGA Technology Integration will be a panelist on the evening panel “Looking for the Next Killer Application: Will Heterogeneous Integration be the Enabler?” on Tuesday, March 19 from 7:00 – 8:00 PM.

3月21日(木)10:00-10:30 - THA1:Heterogeneous 2D& 3D Integration Track:製品アプリケーション
Mike Kelly、チップレット/FCBGA技術統合担当VP(要約

3月20日(水)18:00 - 20:00 - IMAPSポスターセッション
チップレット/FCBGA開発担当シニアディレクター、YoungDo Kweon(要約

ワイヤボンドBGA・MLF製品担当シニアディレクター、KyungSu Kim(要約

“Pursuing Optimal Cost of Ownership in Leadless Leadframe Packaging
Mike Flatley, Sr. Manager, MLF Products & Brad Moore, Sr. Director, MLF Products (abstract)

“Amkor In-house Test Solutions
Vineet Pancholi, Sr. Director, Test Technology (abstract)

開催日:2024年3月18日~2024年3月21日 会場:WeKoPa Resort 開催地:アリゾナ州ファウンテンヒルズ


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