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Accelerating Innovation in Advanced Packaging and Heterogeneous Integration with AI

Amkor Technology will participate in Accelerating Innovation in Advanced Packaging and Heterogeneous Integration with AI, a one-day symposium presented by IMAPS Silicon Valley and hosted by Samsung Semiconductor that explores the technologies and innovations driving the next generation of AI-enabled semiconductor design, advanced packaging, and manufacturing. The event will take place on August 11, 2026, at Samsung Semiconductor in San Jose, California.

Mike Kelly, Vice President, Chiplets and Flip Chip BGA Packaging Development and Integration at Amkor Technology, will present “Power Delivery in the AI Age: Packaging Construction Options.” His session will examine how advanced packaging technologies are evolving to address the growing power delivery challenges associated with AI and high-performance computing applications. Attendees will gain insight into emerging package fabrication methods, advanced design and test strategies, decoupling capacitor approaches, and techniques for reducing parasitic inductance, as well as the role of 2D and 3D integration and high-density module manufacturing in enabling next-generation AI systems.

Through ongoing collaboration with customers, partners, and the broader semiconductor ecosystem, Amkor continues to demonstrate its commitment to innovation and technical leadership while advancing what’s next.