Amkor Technology, a Gold Gala sponsor, invites you to join us at ECTC 2020 on May 26-29 in Lake Buena Vista, Florida at the Walt Disney World Swan and Dolphin Resort. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Amkor is presenting the following:
“Development Extremely High Thermal Conductivity TIM for Large Electronics Package in the 4th Industrial Revolution Era” MiKyeong Choi, HyunHye Jung, KwangSeok Oh, DongSu Ryu, SangHyoun Lee, WonChul Do, YoungDo Kweon, Mike Kelly, KyungRok Park, JinYoung Khim and Ron Huemoeller – Amkor Technology, Inc.
“A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology” SeungNam Son, DongHyun Khim, JinKun Yoo, SangHyoun Lee, SeokHun Yun, MinJae Yi, Ji Hyun Kim, KiYeul Yang, JunHwan Park, WonChul Do and JinYoung Khim – Amkor Technology, Inc.
“High Performance Flip-Chip bonding Mechanism Study with Laser Assisted Bonding” MinHo Gim, ChoongHoe Kim, SeokHo Na, DongSu Ryu, KyungRok Park and JinYoung Kim – Amkor Technology, Inc.
“Heterogeneous Integration using Organic Interposer Technology” George J. Scott, JaeHun Bae, MinJae Yi, WonMyoung Ki, Nathan Whitchurch, SangHyoun Lee, JongHyun Jong, and Curtis Zwenger – Amkor Technology, Inc.
“Alternative Interposer Package on Package with Adhesive Application” – JaeYun Kim, GyuWan Han, SeHwan Hong, SeugJae Yu, DongJoo Park, KyungRok Park, JinYoung Khim, Corey Reichman – Amkor Technology, Inc.
“High Thermal Die-Attach Paste Development for Analog Circuits” – Kiichiro Higaki, Toru Takahashi, Akinori Ono – Amkor Technology, Inc., Daisuke Koike, Masahiko Hori – Toshiba Electronic Devices & Storage Corp., Keiichi Kusaka, Takayuki Nishi, and Takeshi Mori – Sumitomo Bakelite Company, Ltd.
Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.