Events

ECTC 2020

This year’s ECTC 2020 has been moved to a virtual platform and will be available online from June 3-30. Registration is FREE thanks to the “Registration Patron” sponsorship, courtesy of Amkor Technology.

Amkor will be presenting the following:

“Development of Extremely High Thermal Conductivity TIM for Large Electronics Package in the 4th Industrial Revolution Era” MiKyeong Choi, HyunHye Jung, KwangSeok Oh, DongSu Ryu, SangHyoun Lee, WonChul Do, YoungDo Kweon, Mike Kelly, KyungRok Park, JinYoung Khim and Ron Huemoeller – Amkor Technology, Inc.

“A New RDL-First PoP Fan-Out Wafer Level Package Process with Chip-to-Wafer Bonding Technology” SeungNam Son, DongHyun Khim, JinKun Yoo, SangHyoun Lee, SeokHun Yun, MinJae Yi, Ji Hyun Kim, KiYeul Yang, JunHwan Park, WonChul Do and JinYoung Khim – Amkor Technology, Inc.

“High-Performance Flip Chip bonding Mechanism Study with Laser-Assisted Bonding” MinHo Gim, ChoongHoe Kim, SeokHo Na, DongSu Ryu, KyungRok Park and JinYoung Kim – Amkor Technology, Inc.

“Heterogeneous Integration using Organic Interposer Technology” George J. Scott, JaeHun Bae, MinJae Yi, WonMyoung Ki, Nathan Whitchurch, SangHyoun Lee, JongHyun Jong, and Curtis Zwenger – Amkor Technology, Inc.

“High Thermal Die-Attach Paste Development for Analog Circuits” – Kiichiro Higaki, Toru Takahashi, Akinori Ono – Amkor Technology, Inc., Daisuke Koike, Masahiko Hori – Toshiba Electronic Devices & Storage Corp., Keiichi Kusaka, Takayuki Nishi, and Takeshi Mori – Sumitomo Bakelite Company, Ltd.

ECTC is the premier international event that brings together the best in packaging, components, and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

Don’t miss this unique opportunity for FREE presentation attendance. We encourage you to register and invite your friends and colleagues to take advantage of this valuable conference event!