活动

2026 年 SEMI 先进封装峰会

Amkor Technology will participate in Advanced Packaging Summit 2026, a SEMI event focused on the latest developments in advanced packaging technologies and their role in enabling next-generation semiconductor innovation. The event will take place on July 15, 2026, at Convention Hall 1, 3F, Suwon Convention Center in Suwon, South Korea.

As part of the conference program, Shinji Baba, Vice President, R&D Center, Amkor Technology Japan, Inc., will present “Advanced Power Module Packaging Technologies.” His session will highlight recent trends in power devices and power module packaging, covering the key electrical and thermal challenges, representative solutions such as advanced interconnects, cooling architectures, and embedded power modules, and Amkor’s technology roadmap.

By combining advanced packaging expertise with close industry collaboration, Amkor helps enable next-generation power semiconductor solutions and accelerate innovation across automotive and industrial applications while advancing what’s next.