15th Int’l Conference and Exhibition on Device Packaging
Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 4-7, 2019.
IMAPS DPC 是由国际微电子组装与封装协会 (IMAPS) 组织的国际性活动。该会议是供相关领域的主要专家交换信息，并且提供各种技术、社交和结识人脉机会的重要平台。
Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, – Technical Chair – Automotive Semiconductor Packaging Track
“Side Wettable Flanks for Leadless Automotive Packaging”, Marc Mangrum, Director, MLF® Products, Amkor Technology, Inc.
“High-Performance, Heterogeneous IC Packaging Trends”, Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc.
Amkor is a Silver Sponsor for this event. Amkor will be exhibiting at Booth #37 with our packaging experts on hand to answer questions and discuss your IC packaging needs.