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제15회 국제 디바이스 패키징 컨퍼런스 및 전시회

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 4-7, 2019.

IMAPS 국제 디바이스 패키징 컨퍼런스(DPC)는 IMAPS(International Microelectronics Assembly and Packaging Society)가 주관하는 국제 행사입니다. 본 컨퍼런스는 지식 교환을 위한 주요 포럼으로, 이 분야 주요 전문가들과의 다양한 기술적, 사회적 네트워킹 기회를 제공합니다.

Amkor will participate in the following:

Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, – Technical Chair – Automotive Semiconductor Packaging Track

“Side Wettable Flanks for Leadless Automotive Packaging”, Marc Mangrum, Director, MLF^® Products, Amkor Technology, Inc.

“High-Performance, Heterogeneous IC Packaging Trends”, Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc.

Amkor is a Silver Sponsor for this event. Amkor will be exhibiting at Booth #37 with our packaging experts on hand to answer questions and discuss your IC packaging needs.