제15회 국제 디바이스 패키징 컨퍼런스 및 전시회
Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 4-7, 2019.
IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.
Amkor will participate in the following:
Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, – Technical Chair – Automotive Semiconductor Packaging Track
“Side Wettable Flanks for Leadless Automotive Packaging”, Marc Mangrum, Director, MLF® Products, Amkor Technology, Inc.
“High-Performance, Heterogeneous IC Packaging Trends”, Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc.
Amkor is a Silver Sponsor for this event. Amkor will be exhibiting at Booth #37 with our packaging experts on hand to answer questions and discuss your IC packaging needs.
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