イベント

15th Int’l Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 4-7, 2019.

IMAPS DPCは、IMAPS（International Microelectronics Assembly and Packaging Society）が組織する国際的なイベントです。この会議は、知識交換のための主要なフォーラムであり、これらの分野の第一人者と交流を深めるための技術的、社会的、ネットワーキングの機会を多数提供します。

Amkorは次のイベントに参加します：

Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, – Technical Chair – Automotive Semiconductor Packaging Track

“Side Wettable Flanks for Leadless Automotive Packaging”, Marc Mangrum, Director, MLF^® Products, Amkor Technology, Inc.

“High-Performance, Heterogeneous IC Packaging Trends”, Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc.

Amkor is a Silver Sponsor for this event. Amkor will be exhibiting at Booth #37 with our packaging experts on hand to answer questions and discuss your IC packaging needs.