15th Int’l Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 4-7, 2019.

IMAPS DPCは、IMAPS(International Microelectronics Assembly and Packaging Society)が組織する国際的なイベントです。この会議は、知識交換のための主要なフォーラムであり、これらの分野の第一人者と交流を深めるための技術的、社会的、ネットワーキングの機会を多数提供します。

Amkor will participate in the following:

Prasad Dhond, Amkor’s VP and General Manager – Automotive Segment, – Technical Chair – Automotive Semiconductor Packaging Track

“Side Wettable Flanks for Leadless Automotive Packaging”, Marc Mangrum, Director, MLF® Products, Amkor Technology, Inc.

“High-Performance, Heterogeneous IC Packaging Trends”, Mike Kelly, VP, Adv Package & Technology Integration, Amkor Technology, Inc.

Amkor is a Silver Sponsor for this event. Amkor will be exhibiting at Booth #37 with our packaging experts on hand to answer questions and discuss your IC packaging needs.

When: March 4, 2019 - March 7, 2019 Where: WekoPa Resort and Casino Location: Fountain Hills, Arizona

近日開催予定のイベント

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