14th International Conference and Exhibition on Device Packaging
Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.
IMAPS DPC 是由国际微电子组装与封装协会 (IMAPS) 组织的国际性活动。该会议是供相关领域的主要专家交换信息，并且提供各种技术、社交和结识人脉机会的重要平台。
Amkor is a Gold Premier Sponsor and Exhibitor.
Tuesday, March 6th
11:00AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration
Wednesday, March 7th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration