14th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.

IMAPS DPC 是由国际微电子组装与封装协会 (IMAPS) 组织的国际性活动。该会议是供相关领域的主要专家交换信息,并且提供各种技术、社交和结识人脉机会的重要平台。

Amkor is a Gold Premier Sponsor and Exhibitor.


Tuesday, March 6th
11:00AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration

Wednesday, March 7th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration

When: March 5, 2018 - March 8, 2018 地点:亚利桑那州喷泉山 Location: We-Ko-Pa Resort and Conference Center


ISES EU Power 2024

MEMS World Summit Europe 2024

TSMC Technology Symposium Japan 2024