14th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.

IMAPS DPCは、IMAPS(International Microelectronics Assembly and Packaging Society)が組織する国際的なイベントです。この会議は、知識交換のための主要なフォーラムであり、これらの分野の第一人者と交流を深めるための技術的、社会的、ネットワーキングの機会を多数提供します。

Amkor is a Gold Premier Sponsor and Exhibitor.


Tuesday, March 6th
11:00AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration

Wednesday, March 7th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration

When: March 5, 2018 - March 8, 2018 開催地:アリゾナ州ファウンテンヒルズ Location: We-Ko-Pa Resort and Conference Center


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