14th International Conference and Exhibition on Device Packaging
Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.
IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.
Amkor is a Gold Premier Sponsor and Exhibitor.
Tuesday, March 6th
10:30AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration
Wednesday, March 7th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration
Thursday, March 8th
8:45AM – Amkor’s Nozad Karim, VP SiP & Electrical Engineering, will be deliver a keynote discussing System Design Transition from PCB to SiP Solutions.