Events

14th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.

IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

Amkor is a Gold Premier Sponsor and Exhibitor.

Tuesday, March 6^th
11:00AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration

Wednesday, March 7^th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration