14th International Conference and Exhibition on Device Packaging

Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 5-8, 2018.

IMAPS 국제 디바이스 패키징 컨퍼런스(DPC)는 IMAPS(International Microelectronics Assembly and Packaging Society)가 주관하는 국제 행사입니다. 본 컨퍼런스는 지식 교환을 위한 주요 포럼으로, 이 분야 주요 전문가들과의 다양한 기술적, 사회적 네트워킹 기회를 제공합니다.

Amkor is a Gold Premier Sponsor and Exhibitor.


Tuesday, March 6th
11:00AM – “Multi-die Connectivity and the Proposition for Heterogeneous IC Packaging”, Mike Kelly, VP, Adv Package & Technology Integration
12:00PM – “Innovative Wafer Fan-out Technologies – Heterogenous Integration for a Connected World”, Curtis Zwenger, VP, Adv Package & Technology Integration

Wednesday, March 7th
10:45AM – “Automotive Packaging: Evolution, Development and Integration”, Shaun Bowers, VP, Mainstream Advanced Package Integration

When: March 5, 2018 - March 8, 2018 장소: 애리조나, 파운틴 힐즈(Fountain Hills) Location: We-Ko-Pa Resort and Conference Center

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