앰코는 지속적인 패키징 기술연구 및 개발을 통해 IoT 제품의 기술적 과제에 대한 해답을 이끌어냅니다.

Fueled by the rapid growth of the world-wide-web, people have become accustomed to a connected society. Now, the Internet of Things (IoT) provides the ultimate connectivity to objects. This includes wearables, connected (smart) cars, smart homes, smart cities, the Industrial Internet of Things (IIoT) and advanced medical/healthcare diagnostics and monitoring.

 

Amkor’s FCBGA, fcCSP, SiP, SSOP, SOIC, PBGA, MLF®, QFP and CABGA packages along with advanced WLCSP technology meet the design goals for high performance, integrated, efficient and cost-effective IoT end products.

Q & A

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