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Where technology, capacity and service come together to enable the future of electronics

A brief overview or Amkor Technology

If you can build it, Amkor can test it!

Leaders in next generation package design

Amkor – the world’s largest OSAT for automotive ICs

Amkor delivers defect-free products and provides flawless service beyond customer expectations

Solutions for high performance and functionality

Design flexibility for a wide range of end applications

Enabling a smarter world

Enabling high-performance, cost-effective integration of multiple chiplets and memories

Increase integration with a reduced footprint

Ideal solutions for low cost integration at a smaller size

Enable higher semiconductor content in a high performing, small sized package

Flexibility to enable 3D multi-component package designs

Advanced wafer level packaging for integrated package solutions

Turn your passion for innovation into a rewarding career.