웨이퍼 범핑 및 die-level interconnect 기술의 선두주자

웨이퍼 범핑 공정과 die level interconnect 기술이 인증된 앰코의 생산력은 업계에서 비교할 수 없는 수준이며, 이는 통합 사업장 물류를 통한 제품화 기간을 단축시킵니다.

Amkor’s state-of-the-art wafer bumping capabilities in electroplated bumping and several types of Wafer Level Chip Scale Packaging (WLCSP) technologies are offered in strategic locations including: Korea, China, Portugal and Taiwan. These facilities are uniquely situated adjacent to major foundries to provide reduced time-to-market with integrated factory logistics and enables Amkor to provide complete turnkey flip chip and WLCSP solutions in these key geographic areas.

All Amkor facilities have world-class bumping lines with high-volume manufacturing production capability. Solder compositions including 300 mm eutectic, 200 mm and 300 mm lead-free and Cu pillar (all low alpha) are production certified. The facilities also offer repassivation and single- and multi-layer redistribution processes for both flip chip and WLCSP applications.

These facilities offer economy of scale as both plated bump (solder/CuP bump) and WLCSP/Wafer Level Fan-out (WLFO) continue to experience growth. Amkor’s combination of technology and manufacturing capabilities is unparalleled in the subcontract manufacturing industry.

Q & A

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