TISES 2021

Amkor Technology is a proud sponsor of the upcoming Taiwan International Semiconductor Executive Summit being held on December 6-7, 2021. This will be a hybrid event where executives globally will be able to join via LIVE STREAM.

KeunSoo Kim, Sr. Director, Amkor Technology Taiwan will be presenting “Advanced Packaging Technologies Enable New Applications“.

TISES will cover a variety of key topics over the 2 days from Automotive Electronics, Power Semiconductors, AI, Heterogenous Integration, Memory Manufacturing, Smart Manufacturing, Trends and Market Research, Latest in Equipment & Materials Manufacturing and more.

When: December 6, 2021 - December 7, 2021 Where: Taipei, China Location: Taipei Marriott Hotel

More Upcoming Events

ISES EU Power 2024

MEMS World Summit Europe 2024

TSMC Technology Symposium Japan 2024