Amkor Technology is a proud sponsor of the upcoming Taiwan International Semiconductor Executive Summit being held on December 6-7, 2021. This will be a hybrid event where executives globally will be able to join via LIVE STREAM.
Amkor’s Webb Wong, Director, Advanced Product Division will be presenting on Amkor’s advanced packaging solutions.
Title and abstract coming soon.
TISES will cover a variety of key topics over the 2 days from Automotive Electronics, Power Semiconductors, AI, Heterogenous Integration, Memory Manufacturing, Smart Manufacturing, Trends and Market Research, Latest in Equipment & Materials Manufacturing and more.