SEMICON Korea 2024
Amkor Technology invites you to join us at SEMICON Korea 2024 on January 31 – February 2 at the COEX in Seoul, South Korea.
TaeKyeong Hwang, Vice President of R&D Product Development Manager at Amkor Technology Korea will present “Advanced Package Platforms for AI/HPC Applications.”
Recently, to overcome the limitations in the device chip design and manufacturing sector, the role of the back-end process – packaging – has been emphasized, and accordingly, a lot of investment is being made by various companies and institutions in the development of various platform solutions. To make large-size and high-efficiency products beyond the role of simple device chip assembly, TaeKyeong will introduce various development programs in the packaging sector, share the direction of future development, and present standards for device chip packaging in the future.