Amkor Technology invites you to join us at NEPCON Japan on January 19-21, 2022 at the Tokyo Big Sight in Tokyo, Japan.
Akito Yoshida, Sr Vice President, R&D Strategic Planning, will present “Advanced FCBGA Packaging Development in Amkor Technology.”
The advanced Si node continues to evolve with the demand for high-speed, high-performance devices, but the cost is also rising due to the difficulty of process realization. Advanced FCBGA packages have attracted attention to solving this problem. Amkor Technology will be presenting the latest HPC packaging technology.