ISES Advanced Packaging – The Titans Webinar

Amkor Technology is a proud sponsor of the upcoming Advanced Packaging – The Titans Webinar on May 6, 2021, at 07:00 – 10:00 am PST US.

This International Semiconductor Executive Summit (ISES) member-exclusive webinar will consist of the following high-level executive speakers:

Topic: “Advanced Packaging Architectures: Opportunities and Challenges”
Babak Sabi, Corporate VP, GM Assembly and Test Technology Development – Intel

Topic: “3DFabricTM for System Level Innovation”
Marvin Liao, VP Advanced Packaging and Technology Services – TSMC

Topic: “Heterogeneous Integration: Chiplet packaging technology for Next-Generation Devices”
Seungwook Yoon, Corporate VP/Head of Team of Package Technology Strategy and Planning, – Samsung Electronics

When: May 6, 2021 Where: VIRTUAL Location: VIRTUAL

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